Advanced Cooling for Small Form Factor Electronics

Systems are continuing to get smaller and processors morepowerful. Typically as the processing capabilities of a system increase, so does the power consumption, and as a result the amount of heat produced, and sensitive electronics require adequate cooling to ensure consistent operation. Fanless cooling may be desired for a number of reasons including greater IP protection, the ability to shield sensitive electronics from air contaminants, reduced operating noise, and greater reliability.


Unfortunately, the performance of conduction cooling has been limited. Engineers requiring fanless cooling have had two solutions, limit the performance of their boards or opt for expensive liquid cooling or heat pipe solutions. The purpose of this whitepaper is to explain the factors that limit conduction cooling performance, introduce Schroff’s innovative conduction cooling products, and finally to review the performance of the various solutions presented.

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